| 摘要 |
<p>PURPOSE:To provide an electronic circuit part whose reliability in soldering to a printed board or the like is improved. CONSTITUTION:A through hole from an electronic element mounted part 2 on a surface of a substrate 1 through a rear face of the substrate 1 is provided. An electrode recess 4 on a rear face and a side is provided on a side of the substrate 1. A conductor layer on the electronic element mounted part 2 and a conductor layer on an inner periphery of the through hole 3 are made continuous, and also the conductor layer on the inner periphery of the through hole 3 and a conductor layer 5c for an electrode formed on the electrode recess 4 are made continuous. An electronic device 6 is mounted on the electronic device mounted part 2, and also sealing resin 7 is molded on the surface of the substrate 1 for sealing the electronic device 6. Even if the through hole 3 is filled with the sealing resin 7 when the sealing resin 7 is molded on the surface of the substrate 1, the electrode recess 4 not opened on the surface of the substrate 1 is not filled with the resin 7, so that the conductor layer 5c for the electrode formed on the electrode recess 4 may not be covered by the resin 7.</p> |
