WAFER CLEAVING JIG AND CLEAVING METHOD FOR WAFER,申请号JP19940080126-传众专利搜索

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发明名称	WAFER CLEAVING JIG AND CLEAVING METHOD FOR WAFER
摘要
申请公布号	JPH07288241(A)	申请公布日期	1995.10.31
申请号	JP19940080126	申请日期	1994.04.19
申请人	NEC KANSAI LTD	发明人	ISONO KAORU
分类号	H01L21/301;(IPC1-7):H01L21/301	主分类号	H01L21/301
代理机构		代理人
主权项
地址

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