| 摘要 |
PURPOSE: To integrate power circuits with other analog and logical circuits in a single integrated circuit, by providing an integrated circuit package including bonding wires for connecting output bonding pads to output pins. CONSTITUTION: An integrated element has three VDD voltage source bonding pads connected to package pins VDD-1 through bonding wires 210-212, output bonding pads OUT-1A to 1C connected to package pins OUT-1 through bonding wires 213-215, and voltage source bonding pads VSS-1A01C connected to package pins VSS-1 through bonding wires 216-218. Thus, power circuits are integrated with other analog and logical circuits in a single integrated circuit. |
