| 摘要 |
PURPOSE:To provide a semiconductor device in which the miniaturization and the high efficient heat radiation of an axial surface mount are performed, its manufacturing method and a semiconductor module. CONSTITUTION:The lead 2 of a first lead frame and the lead 3 of a second lead frame are provided so that they are in parallel to each other and at least a part of them overlaps each other in the plane of projection. The rear surface of an inner lead or a die pad can be exposed from a semiconductor package. Thereby, the number of an outer lead can be increased, and the size of a semiconductor device can be reduced, and the density of mount can be increased. |
