发明名称 MANUFACTURE OF INJECTION MOLDED CIRCUIT COMPONENT
摘要 PURPOSE:To form an electric circuit in which types of using chemicals are reduced by roughing an exposed surface of a primarily molded form of easily platable resin by sand blasting after secondary molding is finished, and electrolessly plating it after cleaning it. CONSTITUTION:After easily platable resin 1 mixed with electrolessly plating catalyst is primarily injection molded, hard platable resin 2 not mixed with the catalyst is so secondarily injection molded that part of primarily molded form of the resin 1 is exposed and its exposed surface becomes a predetermined electric circuit pattern 3. After the secondary injection molding is finished, the exposed surface of the resin 1 of the secondarily molded form is roughened by a sand blasting method by using abrasive particles. Thus, surface unevenness of the exposed surface of the resin 1 is increased to increase its surface area. Then, when it is electrolessly plated after cleaning, adhesive properties of the electric conductor film 3 with the resin 1 is improved. Accordingly, types, using amounts of chemicals to be used are decreased, safety is improved, and a manufacturing time is shortened.
申请公布号 JPH07288374(A) 申请公布日期 1995.10.31
申请号 JP19940078491 申请日期 1994.04.18
申请人 HITACHI CABLE LTD 发明人 ASANO HIDEKI;ANDO YOSHIYUKI;OAKU TOSHIYUKI
分类号 B29C45/16;B29K71/00;B29L31/34;C23C18/16;C23C18/22;H05K3/18;(IPC1-7):H05K3/18 主分类号 B29C45/16
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