An electrostatic chuck suppresses the formation of vacuum arcs between the back of the wafer being processed and the body of the chuck by the interposition of a guard ring that floats close to the self-bias potential induced by the plasma on the wafer, thereby capacitively dividing the voltage between the wafer and the closest electrode.
申请公布号
US5463525(A)
申请公布日期
1995.10.31
申请号
US19930169932
申请日期
1993.12.20
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
BARNES, MICHAEL S.;KELLER, JOHN H.;LOGAN, JOSEPH S.;TOMPKINS, ROBERT E.;WESTERFIELD, JR., ROBERT P.