| 摘要 |
PURPOSE:To improve cooling property without sacrificing the number of leads. CONSTITUTION:A cooling member 32 is provided on the upper surface of a resin package 38. The extension parts of support bars 34-1-34-4 protrude from a chamfered surface 38g of the corner of the resin package 38 to the outside of the resin package 38. The protruding part is provided with a leading part 34-1a-1 and a rug part 34-1a-2 for fixing. The rug part 34-1a-2 is tentatively fixed to the cooling member 32. The heat of the semiconductor chip 36 is led to the outside of the resin package 38 from each corner part of the resin package 38 through the support bars 34-1-34-4. |
