| 摘要 |
<p>PURPOSE:To greatly improve the stability with time of resistance, etc., without increasing the thickness of an entire substrate and without causing cost increase due to the increase in the number of processes. CONSTITUTION:Protection sheets 5A and 5B which can shield external air are laminated on the surfaces of insulation bases 4A and 4B in the hybrid circuit substrate where a thin-film oxide element 1 such as a thin-film resistance element is included between the insulation substrates 4A and 4B.</p> |
