| 摘要 |
PURPOSE:To provide a machine capable of easily mounting a new electronic device requiring no strict management control for loading without crushing solder using a conventional stroke characteristic even when an electronic device is mounted so far as being approximate. CONSTITUTION:In an electronic device mounting machine repeating suction of an electronic device 2 at a feeder by a nozzle and transfering it to a desired position of a substrate 1 followed by mounting the electronic device on the substrate with release of suction and returning, a compression spring 13e is mounted between a Z-axis table 4 and a suction nozzle part 13d. When a nozzle is driven by a servomotor, the compression spring is extended so that a lead of the electronic device comes in contact with solder of a printed substrate and only the guide part further goes down and the nozzle suction part stops at the spot where the spring force is balanced with solder elasticity so that the further decending guide part does not press the compression spring. Accordingly, inspite of an existing warp of the printed substrate, plenty of stroke characteristics are not required to be provided. |
