发明名称 LASER TRIMMING METHOD OF CIRCUIT ELEMENT FORMED OF COPPER FOIL OF PRINTED WIRING BOARD
摘要 PURPOSE:To provide an excellent laser trimming method wherein a copper foil bridge to be formed in the working trench part of a copper foil is excluded, and stable working is realized, when a circuit element formed of the copper foil of a printed wiring board which is used in a high frequency circuit of various kinds of electronic apparatuses is subjected to trimming by using a laser oscillating equipment. CONSTITUTION:The spot diameter (b) of a laser beam 8 on a working surface which beam is irradiated from a laser oscillating equipment is made intendedly larger than or equal to the thickness (a) of a copper foil 2 of a printed wiring board 1. Thereby a working trench 5 of the copper foil 2 is made wide, so that the bridge to be formed by recombination of the copper foil fused in the trench can be excluded.
申请公布号 JPH07283511(A) 申请公布日期 1995.10.27
申请号 JP19940072140 申请日期 1994.04.11
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 HARAZONO BUNICHI;IGAWA HIRONOBU
分类号 B23K26/00;B23K26/38;H05K3/08 主分类号 B23K26/00
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