发明名称 |
LASER TRIMMING METHOD OF CIRCUIT ELEMENT FORMED OF COPPER FOIL OF PRINTED WIRING BOARD |
摘要 |
PURPOSE:To provide an excellent laser trimming method wherein a copper foil bridge to be formed in the working trench part of a copper foil is excluded, and stable working is realized, when a circuit element formed of the copper foil of a printed wiring board which is used in a high frequency circuit of various kinds of electronic apparatuses is subjected to trimming by using a laser oscillating equipment. CONSTITUTION:The spot diameter (b) of a laser beam 8 on a working surface which beam is irradiated from a laser oscillating equipment is made intendedly larger than or equal to the thickness (a) of a copper foil 2 of a printed wiring board 1. Thereby a working trench 5 of the copper foil 2 is made wide, so that the bridge to be formed by recombination of the copper foil fused in the trench can be excluded. |
申请公布号 |
JPH07283511(A) |
申请公布日期 |
1995.10.27 |
申请号 |
JP19940072140 |
申请日期 |
1994.04.11 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
HARAZONO BUNICHI;IGAWA HIRONOBU |
分类号 |
B23K26/00;B23K26/38;H05K3/08 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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