| 摘要 |
<p>PURPOSE:To reduce thickness by connecting an outer leading-out terminal for coil connection which is formed on a printed wiring board for a module, with the corresponding terminal of an integrated circuit element in the board, connecting the integrated circuit element with a power supply in the hoard, and sealing en bloc terminals except the outer leading-out terminal. CONSTITUTION:A printed wiring pattern 4 is formed by chemically etching a copper foil on an insulating board 1. Recessed parts 3a-3c are formed besides an outer leading-out terminal 4b for coil connection. An integrated circuit element 5 is held with the copper foil of the recessed part 3a. The I/O terminals of the integrated circuit 5 are connected with the terminals 4a, 4a composed of the copper foil of the recessed parts 3c, 3c by using metal wires 6. A chip type capacitor 7 is mounted on a pair of terminals 4a, 4a composed of the copper foil of the recessed cart 3b. The integrated circuit element 5 is connected with a power supply on a printed wiring board. Terminals except the outer connection terminal are sealed en bloc by using sealing material. Thereby the thickness of the whole part can be reduced.</p> |
