| 摘要 |
PURPOSE:To provide a surface light emission laser packaging structure, Wherein in a lower surface emitting type surface light emission laser formed into a facedown structure, the heat characteristics of an element is good and the high-frequency characteristics of the element are superior. CONSTITUTION:A surface light emission laser packaging structure consists of surface light emission lasers 2, 3, 4 and 5, which are formed on a semiconductor substrate 1 transparent to their oscillation wavelengths, an electric wiring 8 for driving the lasers 2, 3, 4 and 5 or for sending a signal or a substrate 7 mounted with an electronic circuit and solder bumps 9 for connecting electrically the substrate 7 with the lasers 2, 3, 4 and 5. |
