| 摘要 |
PURPOSE:To provide a bonding tape capable of simultaneously performing die bonding and lead bonding of a semiconductor chip on top of a lead frame as well as a semiconductor device using the bonding tape and its production method. CONSTITUTION:A bonding tape comprises a first thermoplastic resin 11 having a plurality of openings 14, a wiring layer 12 consisting of copper, and a second thermoplastic resin layer 13 adhering through the first thermoplastic resin layer 11 and the wiring layer 12, the wiring layer 12 being used for electrically connecting the semiconductor chip to the lead wire, and the second thermoplastic layer 13 being adhered to the top of an island of the lead frame. |
