| 摘要 |
PURPOSE:To provide a method of manufacturing a semiconductor device, wherein the device can be enhanced in productivity dispensing with a frame mounting process. CONSTITUTION:A semiconductor device is manufactured through such a method that a semiconductor element is mounted on a board, a screen having an opening is laid on the board so as to enclose the semiconductor element with the opening, a prescribed amount of resin sealer is filled into the opening front above the board, the screen is detached, and then the board and the semiconductor element are sealed up with resin in one piece into a semiconductor device, wherein the resin sealer is formed of material which has high light transmission properties and cured as kept in a shape almost similar to the opening after the screen is detached. |
