| 摘要 |
<p>PURPOSE:To perform contactless soldering work easily and reliably even though the bonding density is extremely high. CONSTITUTION:A thin solder foil 6 is adhered to an upper face portion of the tip of a lead terminal 2 of a film carrier 3 of TAB mounting a semiconductor element 1. By doing this, the deformation of a lead terminal during cutting, forming or soldering does not occur. Also, the solder foil 6 is melted and has no thermal expansion, so that the short-circuit of the lead terminal does not occur and the copper patterns and lead terminal are not deviated.</p> |
