摘要 |
PURPOSE:To obtain a wire bonding device, wherein a wire is lessened in shaking because a flow of gas is stabilized, contaminant attached to a gas guide plate earn be recognized at a glance, and a cleaning operation can be very easily carried out, and a manufacturing cost is lessened. CONSTITUTION:A tension imparting means 20 which is provided between a spool 15 wound with a wire 14 and a capillary so as to impart tension to the wire 14 is composed of a nozzle 21 which jets out gas and a gas guide plate 24 which is provided along the direction of a flow of gas jetted from the nozzle 21. |