发明名称 WIRE BONDING DEVICE
摘要 PURPOSE:To obtain a wire bonding device, wherein a wire is lessened in shaking because a flow of gas is stabilized, contaminant attached to a gas guide plate earn be recognized at a glance, and a cleaning operation can be very easily carried out, and a manufacturing cost is lessened. CONSTITUTION:A tension imparting means 20 which is provided between a spool 15 wound with a wire 14 and a capillary so as to impart tension to the wire 14 is composed of a nozzle 21 which jets out gas and a gas guide plate 24 which is provided along the direction of a flow of gas jetted from the nozzle 21.
申请公布号 JPH07283264(A) 申请公布日期 1995.10.27
申请号 JP19940093792 申请日期 1994.04.07
申请人 SHINKAWA LTD 发明人 TORIHATA MINORU;MAKI SHINJI
分类号 H01L21/60;B23K20/00;(IPC1-7):H01L21/60 主分类号 H01L21/60
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