发明名称 MULTILAYER PRINTED INTERCONNECTION BOARD
摘要 PURPOSE:To improve heat resistance, thermal shock resistance, dipping property, and flame retardance by a prepreg obtained by reacting bisphenol A-type epoxy resin, novolac-type epoxy resin, and tetrabromobisphenol A. CONSTITUTION:A prepreg is produced by reacting bisphenol A-type epoxy resin, novolac-type epoxy resin, and tetrabromobisphenol A in the process for dipping epoxy resin varnish to a glass non-woven cloth. Namely, each constituent with a low molecule before reaction is applied to the glass non-woven cloth to improve the dipping property to the glass non-woven cloth. Also, by promoting the reaction of each constituent when manufacturing the prepreg, the competitive reaction between the epoxy resin, tetrabromphenol A, and a curing agent is controlled, thus improving migration property, interlayer connection force, flame retardance, drill-machining property, thermal shock resistance, and plate thickness accuracy.
申请公布号 JPH07283545(A) 申请公布日期 1995.10.27
申请号 JP19940087513 申请日期 1994.04.01
申请人 TOSHIBA CHEM CORP 发明人 MAEKAWA SATOSHI;FUKUKAWA HIROSHI
分类号 H05K1/03;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/03
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