| 摘要 |
PURPOSE:To accurately, rapidly align an electronic device such as a grid array package, etc., having electrodes on a rear surface on a printed board when the device is mounted on the board. CONSTITUTION:1) A method for mounting an electronic device 1 comprises the steps of opening a through hole 2 opened at a package 1 of an electronic device, providing a reference mark 4 on a printed board 3, aligning the hole 2 at the mark 4 and then mounting the device 1 on the board 3. 2) A visual observation is used for the aligning, or a light beam is scanned, a scattered light is received from the hole, and its position is detected. 3) The package 1 of the device is a ball grid array package or a land grid array package. 4) The hole 2 is opened through the electrode board of the package 1. |
