| 摘要 |
PURPOSE:To reduce the occurrence of disconnection by notching without making processes complicated and, at the same time, to minimize the increase of the capacity of a multilayer interconnection board caused by the increase of the wire width of wiring. CONSTITUTION:The wire width of upper-layer wiring 10 near step sections 5 and 5 at the intersection of multilayer interconnection is made thicker than that in the other places. The wire width of the wiring 10 at the other place is set to a fixed value which is thinner than that near the step sections 5 and 5. Therefore, the occurrence of disconnection is reduced even when wedge-like notches 7, 7,..., 7 are formed in the wiring 10, because the wire width is increased. |
