摘要 |
PURPOSE: To provide an infrared sensor and its manufacture which involve a process simplified by using aerial array technique in planar microelectronics, without requiring an etching process of a silicon substrate. CONSTITUTION: A substrate 30 and a supporting platform 32 are provided to create a space part 39 for thermal insulation therebetween. A number of infrared sensors 37 is arranged at uniform intervals on the supporting platform 32, located in an upper part of the space part 39. Its manufacturing method comprises a process of forming a sacrificial layer 31 over a prescribed region in an upper part of the substrate 30, a process of forming the supporting platform 32 on the substrate 30, so as to cover the sacrifical layer 31, a process of forming a number of infrared sensors 31 arranged at uniform intervals on the supporting platform 32 located in an upper part of the sacrificial layer 31, and a process of forming the space part 39 for thermal insulation while removing the sacrificial layer 31.
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