| 摘要 |
PURPOSE:To obtain insulating paste excellent in adhesion to a semiconductor chip, free from voids, and capable of keeping the lead frame free from warpage and coping with the enlargement and surface mounting of the semiconductor chip. CONSTITUTION:Insulating paste is composed of integral components, epoxy resin which includes above 80% multifunctional epoxy resin (A), aluminum compound (a) having an organic group and silicone compound or organosilane compound (b) having one or more OH groups or one or more hydrolyzable groups directly bonded to Si in each molecule as curing catalyst (B), and insulating powder (C). A semiconductor chip and a lead frame are jointed together with the above insulating paste. |
