| 摘要 |
PURPOSE:To prevent drawbacks such as flaws and cracks in a dicing process by dividing a semiconductor device pattern into a core part and a scribe part, by arranging each thereof separately, by preparing a glass mask whose scribe line configuration is complete in any part and by using it. CONSTITUTION:Illustrated corner parts 21, 22, 23, 24 are combined and composed to produce another corner part 2 as shown in the Figure (b). Similarly, breadthwise parts 31, 32 are combined, a breadthwise part 3 and lengthwise parts 41, 42 are combined and a lengthwise part 4 is prepared. The, a plurality of core parts 1 are arranged as desired as shown in the Figure (c), and scribe parts 2, 3, 4 are arranged to enclose the core part 1. A glass mask is prepared by arrangement prepared by the said method, and a configuration of a scribe line in all the parts can be made complete by manufacturing a semiconductor device by using it. |
