| 摘要 |
<p>PURPOSE:To uniformly heat a substrate and to obtain pattern dimension with excellent in-plane uniformity by placing the substrate to be heated on a lower heat plate and heating the substrate to be heated by arranging the lower surface of an upper heat plate closely to the outside circumference of the substrate to be heated. CONSTITUTION:The lower heat plate 1 is heated by a heater 2 and the upper heat plate 3 is heated by a heater 4 so that the temperature thereof is adjusted to be 110 deg.C, for example, by temperature sensors 7 and 8 and temperature adjustment equipments 9 and 11. Then, the heat plate 3 is lifted upward by a driving mechanism and a photomask 10 is placed on the heat plate 1. Next, the heat plate 3 is lowered and stopped at such a position that the gap between a ring plate 5 (dotted and oblique line part) and the upper surface of the photomask 10 is made a prescribed distance. In such a case, since the side part 10a and the corner part 10b of the photomask 10 are heated by the ring plate 5, temperature difference between the center part is made small. As the result, dimensional difference between the corner part 10b and the center part is minimized to improve the uniformity.</p> |
