| 摘要 |
<p>PURPOSE:To correct a deviation caused by a new blade in indexing when a blade is replaced with a new one in dicing by a method wherein a sub-table provided adjacent to a main chuck table which holds a work such as a semiconductor wafer is made to hold a small work piece by suction. CONSTITUTION:A sub-table 14 is fixed extending in the direction of an X axis through the intermediary of a stay 16 to the certain spot of a movable table 15 on which a main cluck table 10 is mounted. Suction holes 20 are provided on the surface of the sub-table 14 so as to attract a small work 17 by suction or the upside of the sub-table 14 is formed of a porous member 21 and made to communicate with a suction source. The sub-table 14 is provided with a suction section to hold the small work 17 of 100mm<2> area or the like, and the periphery of the suction section is flat and level with the upside of the main chuck table 10.</p> |
