| 摘要 |
<p>PURPOSE: To provide a weight manufacturing method in the manufacturing of a semiconductor acceleration sensor and a vibration sensor having the weights different from each other on each chip, by forming the weight of the specific amount and size, onto a metallic pad formed by a weight base. CONSTITUTION: The weight 8 of the specific amount and size, can be mass produced, by applying the dispensing, electric gilding, screen printing and preform methods, when the weight 8 of the desired size and shape, composed of the metallic paste, is manufactured on a weight base 9 of a metallic thin film formed on a beam with a specific pattern.</p> |
