WAFER SCALE OPTOELECTRONIC PACKAGE

摘要

A package (46) and method for packaging optoelectronic components is provided in which multiple chip regions (48) are packaged simultaneously prior to sectioning of the wafer into chips. The method and package allows micro-optic and other package elements (52) to be integrated onto wafers (42) on the same face as the optoelectronic or electronic devices without inhibiting the ability to make electrical contact to the devices. The package elements (30) may be integrated to the wafer by material deposition, by spinning, or by physical mounting.