| 摘要 |
The invention relates to a method of manufacturing a device provided with a body (1) with a surface (2), at least a portion (3, 4) of the surface (2) being provided with a radiation-sensitive layer (6), after which portions (7, 8) of the radiation-sensitive layer (6) are exposed to radiation (10) through a mask (12) and brought into a pattern. Such a method is particularly suitable for the manufacture of devices in which bodies (1) are used as, for example, printed circuit boards, connections foils for, for example, ICs, or adapter plates between ICs and printed circuit boards. A method of the kind mentioned above is known whereby conductor patterns are provided on an upper and a lower side (22, 24, respectively) of a printed circuit board of a complicated three-dimensional (3-D) shape. For this purpose, a photosensitive layer (6) is provided on a conductive layer through electrodeposition and is illuminated through an upper and a lower mask, developed, and patterned. This known method as described has the disadvantage that several masks are used. The method is complicated and expensive as a result. According to the invention, the method is characterized in that a portion of the radiation-sensitive layer (6) is irradiated directly through the mask (12), while another portion is radiated indirectly via the mask (12) and a surface (13) which reflects the radiation (10). It is achieved thereby that several portions (7, 8) of the radiation-sensitive layer (6) can be illuminated by means of one mask. The use of one mask (12) and a reflecting surface (13) is simpler and cheaper.
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