Verfahren zur Herstellung von Optokopplern

摘要

The method involves spraying a strip (1) of e.g. Copper alloy with plastic which forms a pot-shaped lower portion (2) with a 5 mm square base which is 2 mm high. Transmitting and receiving semiconductor chips (3,4) are placed in the opening and connected by eg. 230 micron thick Gold wire.The opening is filled with eg. 1 ml. of transparent epoxy resin (5) and capped (6) with more plastic under a snap fastening. High reflectivity under the cap enhances transmitter-receiver optical coupling (7).