发明名称 |
Low temperature ternary C4 method. |
摘要 |
Flip chip bonding an IC chip to a carrier comprises depositing a high m.pt. compsn. on one set of contacts and a lower m.pt. compsn. on the facing contacts, and heating in contact to form a still lower m.pt. compsn. by the lower m.pt. compsn. dissolving the higher, and solder bonding with this alloy. Also claimed is a method as above in which Pb/Sn alloy is deposited on chip contacts, Bi/Sn alloy co-deposited on the carrier contacts, and the low m.pt. ternary Pb/Sn alloy forms the solder bond. |
申请公布号 |
EP0678908(A1) |
申请公布日期 |
1995.10.25 |
申请号 |
EP19950101690 |
申请日期 |
1995.02.08 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GALL, THOMAS PATRICK;INGRAHAM, ANTHONY PAUL |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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