| 摘要 |
An improved apparatus for use in the electroplating of one or more selected areas of a workpiece include pressing the workpiece against a work holding member with an opening in the work holding member and pumping an electrolyte from a source of electrolyte and having three holes therethrough, (37a), (37b), and (37c) corresponding to the holes (26a), 26(b), and 26(c) in the manifold(18).
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