SEMICONDUCTOR WAFER EDGE SECTION POLISHING DEVICE

摘要

PURPOSE:To provide a semiconductor wafer edge section polishing device which can improve polishing work efficiency and a yield. CONSTITUTION:In a polishing device which is provided with a cylindrical rotatable polishing cloth 13 and mechanisms 19, 21 which can hold and rotate a wafer 1 in such a way that a wafer edge face to be polished is in contact with a surface of the polishing cloth and polishes a wafer edge section 2 while rotating the wafer 1, a surface roughness detector 27 which is arranged in such a way that a detection end 29 is in proximity to the wafer edge section 3 is provided.