发明名称 |
Lead, method of assembling an integrated circuit device, integrated circuit device, lead for providing a conductive path and method of providing a conductive path |
摘要 |
A lead for achieving solder joining with great vibration strength includes an upper lead portion having a clip and a lower lead portion having a thin tip for insertion into an electrode in a lower substrate and an oblong through hole in the body of the lower lead portion for inducing capillarity of soldering flux.
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申请公布号 |
US5460319(A) |
申请公布日期 |
1995.10.24 |
申请号 |
US19930080622 |
申请日期 |
1993.06.22 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
KATO, HAZIME |
分类号 |
H01L23/50;H01R4/02;H01R12/04;H01R12/32;H01R43/02;H05K1/14;H05K1/18;H05K3/30;H05K3/34;H05K3/36;(IPC1-7):H05K3/34 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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