发明名称 |
Method for processing wafer-shaped substrates |
摘要 |
An apparatus for coating and developing a resist on a wafer comprises a carrier station provided with a plurality of carriers for receiving wafers and transfer tables, a processing section having a plurality of processing units, and a transfer robot provided between the carrier station and the processing section. The robot comprises a plate-shaped arm for transferring wafers between the carriers and the transfer tables, and two horseshoe-shaped forks for transferring wafers between the processing units and transfer tables. The robot is movable along a transfer path so as to make the arm and forks face the carriers, processing units and transfer tables.
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申请公布号 |
US5460478(A) |
申请公布日期 |
1995.10.24 |
申请号 |
US19950403138 |
申请日期 |
1995.03.13 |
申请人 |
TOKYO ELECTRON LIMITED;TOKYO ELECTRON KYUSHU LIMITED |
发明人 |
AKIMOTO, MASAMI;YOSHIOKA, KAZUTOSHI;IIDA, NARUAKI |
分类号 |
B65G1/00;B65G1/07;B65G49/07;H01L21/677;H01L21/683;(IPC1-7):B65G1/00 |
主分类号 |
B65G1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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