发明名称 |
ELECTRONIC COMPONENT SEALING FILLER |
摘要 |
<p>A filler to be dispersed, as an inorganic material, in a thermosetting resin to produce an electronic component sealing agent, is composed of crystalline silicon dioxide particles. Not less than 70 wt-% of the crystalline silicon dioxide particles have the major-to-minor-axis ratio in the range of 1.20-1.40 and the circularity in the range of 0.75-0.90.</p> |
申请公布号 |
KR950013045(B1) |
申请公布日期 |
1995.10.24 |
申请号 |
KR19920010898 |
申请日期 |
1992.06.23 |
申请人 |
TOSHIBA CERAMICS CO., LTD. |
发明人 |
NAKANO, YOJI;UENO, RYUJI;MAEDA, TOSHIAKI |
分类号 |
H01C1/02;C08K3/36;C09C1/30;H01L23/29;H01L23/31;(IPC1-7):H01L23/29;C04B14/04 |
主分类号 |
H01C1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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