发明名称 ELECTRONIC COMPONENT SEALING FILLER
摘要 <p>A filler to be dispersed, as an inorganic material, in a thermosetting resin to produce an electronic component sealing agent, is composed of crystalline silicon dioxide particles. Not less than 70 wt-% of the crystalline silicon dioxide particles have the major-to-minor-axis ratio in the range of 1.20-1.40 and the circularity in the range of 0.75-0.90.</p>
申请公布号 KR950013045(B1) 申请公布日期 1995.10.24
申请号 KR19920010898 申请日期 1992.06.23
申请人 TOSHIBA CERAMICS CO., LTD. 发明人 NAKANO, YOJI;UENO, RYUJI;MAEDA, TOSHIAKI
分类号 H01C1/02;C08K3/36;C09C1/30;H01L23/29;H01L23/31;(IPC1-7):H01L23/29;C04B14/04 主分类号 H01C1/02
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