| 摘要 |
Disclosed is an integrated circuit lead frame which comprises: a die-pad; die-pad suspension leads for supporting the die-pad; a number of inner leads provided around the die-pad so as to be separated from the die-pad at a predetermined distance, and connected through wires with electrodes of an integrated circuit fixed onto the die-pad; wherein a step portion having a sharp corner portion is provided in at least one portion of the lead frame. Further disclosed is a method of producing such an integrated circuit lead frame as mentioned above, wherein a portion between one of the die-pad suspension leads and one of the inner leads adjacent to the one die-pad suspension lead is stamped out through two or more steps to thereby form a step portion having a sharp corner portion in a side portion of the one die-pad suspension lead or the one inner lead. Thus, since the step portion is formed through two or more steps, the step portion may have an corner portion which is sharp and which has no shear drop so that it is possible for an image recognition apparatus to recongnize the step portion accurately and rapidly to thereby perform the recognition with no error. |
