Cavity filled metal electronic package

摘要

There is provided an electronic package (70) where the package components (52, 54) define a cavity (56). A semiconductor device (16) and a portion (18) of a leadframe (20) occupy part of the cavity (56). Substantially the remainder of the cavity (56) is filled with a polymer (26) so that an outermost surface (74) of the polymer (26) is coplanar with a surface (76) of one of the package components (54).