发明名称 MANUFACTURING METHOD OF CHIP TYPE ELECTRONIC PARTS
摘要 PURPOSE:To eliminate unstable factor at welding far obtaining the constant welding-result by irradiating the welding part, of a lead frame with a lead wire with laser, removing a melted solder and then welding the lead wire to the welding place. CONSTITUTION:A lead frame 1 wherein nickel plating is performed as base material plating, and over it, solder plating is performed, is formed. And, before welding, laser beam is let to travel on the welding part of the lead frame 1 in width direction, so that plate solder is melted, and following this laser beam, a decompressed suction nozzle is let to travel far removing melted solder, thus a plated solder removal part 5 is formed. To the plated solder removal part 5, an anode lead wire 3 is spot-welded 4. Thus, the welding with high strength and little variation is realized.
申请公布号 JPH07272981(A) 申请公布日期 1995.10.20
申请号 JP19940085720 申请日期 1994.03.30
申请人 MARCON ELECTRON CO LTD 发明人 MIURA NORIYASU;TAMAKI JUNICHIRO
分类号 B23K26/00;B23K1/00;H01G9/012;H01L23/48 主分类号 B23K26/00
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