| 摘要 |
PURPOSE:To improve the bond properties in the low heat expansion polyimide/ resist interface by a method wherein the polyimide resin surface is amidated and after coupling the amidated surfaces, the polyimide resin in the heat expan sion coefficient not exceeding a specific value is used as the interlayer insulating film of multilayer-wiring board. CONSTITUTION:An electrolytic copper foil 1 is coated with poly amic acid to form a polyimide layer 2. At this time, as for the polyimide, a low heat expansion polyimide in the heat expansion coefficient not exceeding 2.5X10<-5> deg.C<-1> is used. Next, the region in a specific thickness of the surface layer part of the low heat expansion polyimide amidated and the washed up surface immersed in a coupling solution adjusted in a specific concentration is dried up to form a bonding layer 3. Next, a specific resist pattern 4 is formed on the polyimide surface and after removing the specific part of the polyimide resin to form a blind via hole, the pattern 4 is released. Finally, a metallic thin film is provided on the polyimide surface and in the blind via hole 5 so as to form wiring patterns 6. |
