MOUNTING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To increase the yield by filling a recess made in a wiring board with two types of solder paste and flip-chip mounting a semiconductor device thereby eliminating the bridging of adjacent solder bumps perfectly. CONSTITUTION:A recess made in the surface of a wiring board 3 while facing a solder bump 2 on a semiconductor device 1 is filled with a first solder paste 6 which is then solidified. The space of the recess 4 above the first solder paste 6 contracted through solidification is then filled with a second solder paste 7 having melting point lower than that of the first solder paste 6. Subsequently, the recess 6 of the wiring board 3 is aligned with the solder bump on the semiconductor device 1 and reflow processing is effected at a temperature lower than the melting points of the first solder paste and the solder bump 2 but higher than the melting point of the second solder paste thus connecting the wiring board 3 with the semiconductor device 1. For example, the first solder paste 6 has melting point of 221 deg.C and the second solder paste 7 has melting point of 183 deg.C.