| 摘要 |
PURPOSE:To provide a semiconductor package which is low in cost, compact in structure, and high in reliability. CONSTITUTION:A semiconductor package is equipped with a board 6 provided with a wiring circuit 6a which includes a connector 6b formed on its primary surface, a semiconductor chip 7 mounted on the primary surface of the board 7 in a face-down manner, a resin layer 10 filled between the semiconductor chip 7 and the board 6, and a plane-type outer connection terminal 9 electrically connected to the semiconductor element 7 and, if necessary, led out and exposed on the other primary surface of the board 7 through a blind viahole connection, wherein the wiring circuit 6a which includes the connector 6b formed on the primary surface of the board 6 is formed nearly flush with the surface of the board 6. |
