| 摘要 |
PURPOSE:To simplify a laser irradiation apparatus and to shorten a laser bonding process by a method wherein, when a lead for a lead frame on which a semiconductor-integrated-circuit element is mounted is bonded to a terminal for connection, a part to be bonded is irradiated with a laser beam from vertically. CONSTITUTION:In a lead frame which is formed of a 42 alloy, the tip part of an inner lead 10 is made thin by a half etching operation. On the other hand, at a terminal, for connection, for a printed-wiring board 11 on which a chip is mounted, an Au plating operation is conducted to the surface of a Cu pattern via an Ni-plated layer. Then, at a part in which the tip part of the lead as a vertically above part to be connected is overlapped with the terminal for connection is irradiated with a laser beam from, so that the part is welded and bonded. Thereby, the driving mechanism of a laser light source is not required, and a laser bonding apparatus is simplified. In addition, the time required for a bonding operation is shortened, and a bad effect due to heating to the printed-wiring board due to an increase in the time required can be reduced. |
