| 摘要 |
PURPOSE:To provide a method and an apparatus for carrying a semiconductor chip to a correct positron and mounting the semiconductor chip in place. CONSTITUTION:When a semiconductor chip 3 is carried to a package 15 and mounted in order to produce a semiconductor device, a single semiconductor chip 3 is vacuum sucked at a plurality of points using a plurality of flat collets 2. When the flat collect 2 is shifted to the package 15 in order to mount the semiconductor chip 3 at a predetermined position on the package 15, evacuation through the flat collet 2 is interrupted and the bonding is effected. |
