ADHESIVE TAPE FOR SECURING SEMICONDUCTOR WAFER

摘要

PURPOSE:To prevent an adhesive from adhering to a pickup pin during a pickup step by employing at least one layer containing specified quantity of calcium carbide having specified grain size in a single layer or a multilayer basic material film. CONSTITUTION:An adhesive tape for securing a semiconductor wafer containing calcium carbide is employed in a basic material film. The content of calcium carbide is set in the range of 1-35 pts.wt. for 100 pts.wt. of basic material resin composing a layer containing calcium carbide. The grain size of calcium carbide is set in the range of 0.5-5mum. Since a hole made by piercing the basic material film with a pickup pin has diameter smaller than that of the pickup, the adhesive is scratched off the surface of the pickup pin and not deposited on the pin. Consequently, erroneous recognition of the profile of a chip is prevented at the time of image recognition.