发明名称 METHOD AND EQUIPMENT FOR MANUFACTURING THIN-FILM PHOTOELECTRIC CONVERSION MODULE
摘要 PURPOSE:To protect the light receiving surface of a thin-film photoelectric conversion module by transparent heat-adhesion resin film before thin-film photoelectric conversion elements are connected with each other, by connecting the electrodes present on one surface of the board for the thin-film photoelectric conversion elements with the auxiliary electrodes present on the other surface of the board via through holes bored in the board. CONSTITUTION:A delivery roll 21 for an insulation flexible film 1 and a delivery roll 22 for a transparent heat-adhesion resin film 31 are provided respectively at one end. In series therewith, two heating rolls 41, 42 for bonding thermally the films 1, 31 to each other while sandwiching the films 1, 31 between them, a punch-heating device 6 for punching partially the insulation flexible film 1 whereon thin-film photoelectric conversion elements 5 are mounted, and a take-up roll 71 are provided in a line. By this line, a conductive tape 9 which is delivered from a delivery roll 24 is traversed orthogonally in the part of the punch-heating device 6, and it is punched by the punch-heating device 6, and further, it is connected with auxiliary electrodes while the solders present on the auxiliary electrodes are fused. Moreover, heating rolls 43, 44, other heating rolls 45, 46 for bonding thermally a weatherproof film 82 to the rear surface of the thin-film photoelectric conversion module, and a take-up roll 72 are provided in a line. Thereby, the thin-film photoelectric conversion modules can be formed continuously without the damages of their surfaces.
申请公布号 JPH07273363(A) 申请公布日期 1995.10.20
申请号 JP19940064285 申请日期 1994.04.01
申请人 FUJI ELECTRIC CO LTD 发明人 YOSHIDA TAKASHI
分类号 H01L31/042;H01L31/0392;H01L31/04;H01L31/048;H01L31/20 主分类号 H01L31/042
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