| 摘要 |
PURPOSE: To connect electronic circuits such that the joint can withstand thermal load by filling the gap between both electronic circuits with a nonconductive curable fluid bonding medium, thereby preventing the quality of mechanical joint from degrading due to electrical connection. CONSTITUTION: After an electronic circuit 5 is set on another electronic circuit 12, such that the contact part is located above another contact part 11 of the another electronic circuit 12, the contact part provided with a droplet 9 of liquid tin is pressed against the another contact part 11, while shaking lightly under high temperature. Consequently, conductive connection is achieved between the contact part and the another contact part 11 so that a fluid solder is bonded to the surface of the another contact part 11. The gap between respective joints is additionally filted with an adhesive 13, which flows into the intermediate room between the circuits 5, 12 by means of capillarity. Flow characteristic and adhesion of the adhesive 13 between the circuits 5, 12 are not degraded by flux. |
