| 摘要 |
PURPOSE:To enhance the packaging density of a semiconductor device and to minimize a package by a method wherein two semiconductor elements are mounted on, and bonded to, a board as an integrated body in which they have been bonded so as to be back to back. CONSTITUTION:A semiconductor-element assembly 12 in which the rear of a first semiconductor element 21 and the rear of a second semiconductor element 22 have been bonded by an adhesive is aligned with a prescribed position on a TAB tape 11. Then, the semiconductor-element assembly 12 is compression- bonded onto inner leads 14 for the TAB tape 11 via bumps 24. After that, a wire bonding operation is conducted, pads 21a for the first semiconductor element 21 on the upper side and leads 16 for the TAB tape 11 are connected by bonding wires 25. Thereby, the packaging density of a semiconductor device is enhanced, and a package can be miniaturized. In addition, since the semiconductor-element assembly 12 is arranged and installed in a part 13A which is formed so as to be recessed in a TAB board, a height to which the semiconductor element 21 on the upper side floats from the TAB board 11 can be made the same as that in conventional cases. |
