| 摘要 |
PURPOSE: To compensate for the thermal expansion and the contraction characteristic between a ceramic board during a reflow process and a following process by preventing generation of stress the solder bonding face between materials through resilient warping. CONSTITUTION: A resilient module assembly is constructed by fixing semiconductor dies 20, 22, respectively, to ceramic boards 16, 18. A preliminary solder molding 14 is interposed between the ceramic boards 16, 18 and a base board 12 on a mounting fixture 26. Steel holding metals 28, 30 are disposed to surround the outer circumference between the base plate 12 and the mounting face. A fixing mechanism 24 is secured to the mounting fixture 26, while penetrating the center of the base board 12 in order to generate a force for warping the base plate 12 by elasticity. The module assembly is subjected to reflow, while being secured by means of a preliminary warping unit and then it is cooled down. |
