发明名称 Microelectronic circuit conductor path connection system
摘要 The connection system is used to provide vertical connections between conductor paths in different metallisation layers of the microelectronic circuit, via a material reservoir in addition to the material of the conductor paths, providing a circuit path between the latter. Pref. the circuit path provided by the material reservoir is electrically connected to the conductor paths in the vertically spaced metallisation planes by contacts formed via a laser beam, the vertical contact structure pref. incorporated in a redundant bus system.
申请公布号 DE19515591(A1) 申请公布日期 1995.10.19
申请号 DE1995115591 申请日期 1995.04.28
申请人 SCHROEDER, HANS-ULRICH, DIPL.-ING., 30165 HANNOVER, DE;UFFMANN, DIRK, DR.-ING., 30163 HANNOVER, DE 发明人 SCHROEDER, HANS-ULRICH, DIPL.-ING., 30165 HANNOVER, DE;UFFMANN, DIRK, DR.-ING., 30163 HANNOVER, DE
分类号 H01L21/768;H01L23/525;(IPC1-7):H01L23/525 主分类号 H01L21/768
代理机构 代理人
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