| 摘要 |
PURPOSE:To secure the handling, and to reduce the fabrication cost by using a half-mirror unit for the mutual positioning between a semiconductor chip and thick- film circuit substrate and by heating the chip and circuit substrate together for bonding. CONSTITUTION:Chip 5 is adsorbed by using pickup tool 11 in which the temperature control loop for heating semiconductor chip 5 and thick-film circuit substrate 6, and under it, mount table 23, on which thick-film circuit substrate 6 with die pattern 7 and lead pattern 8, and solder on them is mounted, is positioned. Next, half-mirror unit 21 is inserted between chip 5 and substrate 6, and after the vacuum inside tool 11 is released, chip 5 is placed on to mirror 21; and then, lead 4 of chip 5 is placed on to mirror 21; and then, kead 4 of chip 5 is placed on to mirror 21; and then, lead 4 of chip 5 is positioned to patterns 7 and 8 of substrate over an observation through microscope 24. Next, chip 5 is adsorbed by tool 11 and unit 21 is moved away; and then, tool 11 is lowered to superpose chip 5 upon circuit 6, and tool 11 and mount 23 are bonded together by being heated. |
