| 摘要 |
<p>A clip lead (47) is provided for soldering to and supporting a first substrate (51) vertically on a second substrate (69) which may be horizontal. The terminal end (71) of the clip is configured to form a stable support for the substrate during soldering (53) in a vertical position to the second substrate (69) by being bent at right angles to and extending under the first substrate.</p> |
